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Features of Datacon product The 2200 apm+ is fully integrated in Datacon's unique platform concept. 300 mm Wafer processing In the loading and unloading of the 2200 apm+ with 300 mm wafer magazines, special attention was paid to the SEMI-compliant design of the transfer height.
Multi Chip Module In just one module, the 2200 apm+ can flip the die, dip it in the dipping unit, and accurately place the component . Flip-Chip-Bonder by die-bonding.net |
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Features of Datacon product The 2200 apm+ is fully integrated in Datacon's unique platform concept. 300 mm Wafer processing In the loading and unloading of the 2200 apm+ with 300 mm wafer magazines, special attention was paid to the SEMI-compliant design of the transfer height.
Multi Chip Module In just one module, the 2200 apm+ can flip the die, dip it in the dipping unit, and accurately place the component . Flip-Chip-Bonder by die-bonding.net |
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Bottom Locking Slats The bottom-locking style slat provides an economical and attractive way to enhance a chain link fence.
Design: Bottom0Locking Slats are flat tubular in shape, with reinforced "legs" inside for extra durability. The patented locking channel provides a "snap in" locking effect for security. Fence Insert Online by fencing-online.com |
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Bottom Locking Slats The bottom-locking style slat provides an economical and attractive way to enhance a chain link fence.
Design: Bottom0Locking Slats are flat tubular in shape, with reinforced "legs" inside for extra durability. The patented locking channel provides a "snap in" locking effect for security. Fence Insert Online by fencing-online.com |
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Datacon Largest Provider of Semiconductor Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as flip chip and RFID (non-contact data transmission). Offering dynamic, flexible concept strategies and latest technologies, Datacon is known in the die bonder market as a solution supplier and an essential research partner for the semiconductor industry worldwide. Flexible Die Attach by flexible-die-attach-solutions.com |
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Datacon Largest Provider of Semiconductor Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as flip chip and RFID (non-contact data transmission). Offering dynamic, flexible concept strategies and latest technologies, Datacon is known in the die bonder market as a solution supplier and an essential research partner for the semiconductor industry worldwide. Flexible Die Attach by flexible-die-attach-solutions.com |
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International R&D Cooperations EV Group, a leading supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, leading supplier of flip chip and die bonding equipment, announce a development agreement in the field of advanced-chip-to-wafer technology (AC2W). The two companies also have agreed on joint strategic marketing and sales activities to promote the cooperation. Flip Chip Bonder System by flip-chip-bonder.net |
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International R&D Cooperations EV Group, a leading supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, leading supplier of flip chip and die bonding equipment, announce a development agreement in the field of advanced-chip-to-wafer technology (AC2W). The two companies also have agreed on joint strategic marketing and sales activities to promote the cooperation. Flip Chip Bonder System by flip-chip-bonder.net |
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Datacon Technology Update Business Option Datacon Technology AG is an internationally operating group of companies which developes and produces high-precision machines for the semiconductor industry and thus supplies leading microelectronics companies worldwide. 450 staff are currently employed under the umbrella of Datacon Technology AG, 110 of whom work in Research and Development. Datacon Semiconductor Equipment GmbH, Radfeld / Austria (development and production of die bonders), Eurotec GmbH, Berlin / Germany (special-purpose machine construction), and Datacon Hungary Kft, Györ / Hungary (component manufacture, assembly) are responsible for the business operations. Flip Chip Die Attach by flip-chip-die-attach.com |
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Datacon Technology Update Business Option Datacon Technology AG is an internationally operating group of companies which developes and produces high-precision machines for the semiconductor industry and thus supplies leading microelectronics companies worldwide. 450 staff are currently employed under the umbrella of Datacon Technology AG, 110 of whom work in Research and Development. Datacon Semiconductor Equipment GmbH, Radfeld / Austria (development and production of die bonders), Eurotec GmbH, Berlin / Germany (special-purpose machine construction), and Datacon Hungary Kft, Györ / Hungary (component manufacture, assembly) are responsible for the business operations. Flip Chip Die Attach by flip-chip-die-attach.com |
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