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Die Attach - Flip Chip Technology at die-attach.net

Datacon Specialist In Semiconductor Solution

The flip chip market will experience extraordinary growth rates in the next several years - and Datacon is prepared for its take-off into high volume. A vital aspect of our corporate philosophy is to provide the best customer support. We place great value on continuously broadening our customer support department, which inturn has enables us to provide customers with specialists at the right time and place. Since its inception in 1986, Datacon has become a leading partner and solution supplier in the semiconductor industry. We are known to set trends in advanced packaging worldwide.
Smaller, faster, cheaper – using the latest microelectronics is a prerequisite for rapidly improving the quality in many areas of life. Datacon’s semiconductor advanced packaging products help consumer goods become cheaper and more compact.
Innovation, the courage to take risks, forward-looking concepts and strategies – these are the cornerstones of our business philosophy. As a true follower of these concepts, Datacon consistently creates innovative, dynamic, customer and market-specific strategies which lead to trendsetting product developments in the back-end assembly field of the Advanced Packaging Market. We pride ourselves on fast, friendly service and competitive prices.

Flip Chip Technology Datacon by die-attach.net

Die Attach - Flip Chip Technology at die-attach.net
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